reflow iphone 3gs motherboard

I'm sure somebody may have tried this. Just looking for pointers. Here's the lead up.
I was to replace the digitizer on this iphone. When opened, I saw a very noticeable bulge or bow in the motherboard. This turned out to be from the battery swelling and pushing up from below(see pics 1 2 3 4). As you can see, the battery is over 13mm thick now instead of around 2.5mm it's supposed to be. I changed the battery, but after that it wouldn't boot. I plugged it in when I put it back together and after a while, the apple logo appeared the vanished. later it repeated. It finally booted to the connect to iTunes screen. I attempted to restore, but ended with various errors. I think I've narrowed it down to the SHSH blobs can't be found. This board went through quite a bend, then a quick release. As I unscrewed the screws, they wanted to launch. As much as I tried, there was no way to release it evenly. It's not hard to imagine a couple of connections getting broke in the process. I found a couple pages showing reflowing to restore wi-fi, but nothing about what I'm planning. I intend to remove the metal covers to allow heat around the chips, and pretty much follow the same tips as for fixing the wi-fi by "baking" the motherboard. Anyone done this before? Got any pointers to share?